High Density Electronics Assembly
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(Difference between revisions)
| Revision as of 08:16, 9 May 2006 Kenji (Talk | contribs) ← Previous diff |
Revision as of 18:49, 19 May 2006 Derusha (Talk | contribs) (→Blueprint) Next diff → |
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| *[[List_of_Factory_Functions#Micro_Assembly|Micro Assembly]] | *[[List_of_Factory_Functions#Micro_Assembly|Micro Assembly]] | ||
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| - | *Electronic Manufacture 5 | + | *[[Electronic Manufacture 5]] |
| - | *Mechanical Manufacture 2 | + | *[[Mechanical Manufacture 2]] |
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| *1 x [[Cryoceram Cord]] | *1 x [[Cryoceram Cord]] | ||
Revision as of 18:49, 19 May 2006
| Assembling or replacing essential micro controller or processing components. |
Blueprint
| Base Value | Production Time | Factory Functions | Abilities | Components |
|---|---|---|---|---|
| 200 | 00:56:40 |
|
