High Density Electronics Assembly
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(Difference between revisions)
Revision as of 08:39, 13 June 2006 Supermagle (Talk | contribs) ← Previous diff |
Revision as of 07:10, 16 June 2006 Quanto Solo (Talk | contribs) (→Blueprint) Next diff → |
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{| border="1" cellspacing="0" cellpadding="3" width="100%" | {| border="1" cellspacing="0" cellpadding="3" width="100%" | ||
- | ! width="10%" | Base Value | + | ! width="8%" | Base Value |
- | ! width="10%" | Production Time | + | ! width="9%" | Production Time |
+ | ! width="8%" | Production Cost (100%) | ||
! width="25%" | Factory Functions | ! width="25%" | Factory Functions | ||
- | ! width="30%" | Abilities | + | ! width="25%" | Abilities |
! width="25%" | Components | ! width="25%" | Components | ||
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| align="center" | 200 | | align="center" | 200 | ||
| align="center" | 00:56:40 | | align="center" | 00:56:40 | ||
+ | | align="center" | 2720 | ||
| | | | ||
*[[Electronic Manufacture]] | *[[Electronic Manufacture]] |
Revision as of 07:10, 16 June 2006
Assembling or replacing essential micro controller or processing components. |
Blueprint
Base Value | Production Time | Production Cost (100%) | Factory Functions | Abilities | Components |
---|---|---|---|---|---|
200 | 00:56:40 | 2720 |
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