Systems Analysis
From Seed
Contents |
Summary
In order to understand TAU, and to know where it is damaged and how to fix it, we must first know how it works. This is a very large project, of which this particular project is only the first step. There are several electronic systems thoughout the cluster, particularly in Labspace. We know where they are (considering we're constantly repairing them), but we do not know what they are. What, exactly, is their purpose?
In order to answer that grand question, we must learn two things: What each substation actually does, and how are they connected to each other. It is possible to determine the answers to both questions by careful analysis of EM emissions and communications along the fiber interconnects. Further information can be gained by through examination of the components themselves, including penetrating scans (XRay, Gamma, Tera, or similar).
Status
We are currently in the planning stage, where we design the tools required to observe, record, and document the various emissions of the electronic systems.
Component Designs:
- Data Recorder - A general data storage device, with interfaces to removable data cartridges and data collection components. It would basically consist of a microprocessor to handle data I/O, and several Atomic Storage Units.
Tool Designs Needed:
- EM scanner, to detect and record EM emissions. This tool will likely require a new design from the ground-up; it requires both a sophisticated signal transciever and a specialized antenna, with which to induce pulses into cables and detect the signals reflected off the ends of the cable. The scanner will also be used to record analog communications between systems, so there needs to be a Data Recorder.
- Signal Analyzer, to intercept and record fiber optic communications. One proposed design is based on a modified CPU Crash Kit; since the CPUCK already interfaces the data lines to perform the software resets when repairing electronic systems, it should be relatively easy to add a Data Recorder, replacing the CPU Maintenance component. The Adaptive Diagnostics and High Density Electronics Assembly would still be required, to detect data streams and interface with the electronic components, respectively.
- Penetrating Scanner, to scan the inner structure of electronic nodes. This role could be filled by a modified 3D Probe Imager, but it would have to be modified to substantially boost resolution and penetration.
Future Steps:
- Production Stage - Production of the tools. Several will be needed.
- Data Collection - Using the tools to collect data on each of the electronic systems in Labspace.
- Analysis - Analysis of the collected data.
Contacts
Toawazae - TAU Divers
Detail
How you can help
At this time, we need people to help with the design of the tools.
